Drawing preferences for floor plans

Enables or disables the information you wish to display on floor plans:

• Distribution
  • Space (Reference, Type, Cooling sensible cooling load, Heating thermal load, Area, Key)
• Radiant floor heating
  • Manifold (Reference, Number of circuits, Key)
  • Obstacle (Reference, Key)
  • Circuit (Reference, System, Pipe, Pipe spacing, Heating flow, Heating power, Cooling power, Occupied area, Manifold, Total length, Circuit length, Service/connection length, Circuit area, Peripheral area, Cooling flow rate, Key)

Drawing options

Configures the layout of floor plans:

• Floor plans
  • Text height
  • Scale divider
  • Text label
    • Shading (optional)

External conditions

Configures the parameters that define the outdoor air:

• Outdoor air
  • Altitude
  • Summer dry-bulb temperature
  • Summer wet-bulb temperature

Design options

Configures the parameters used in calculating the components of the radiant floor system and the requirements for the various checks carried out on them.

• Working fluid
  • Specific heat
  • Density
  • Dynamic viscosity
• Radiant floor manifold
  • Maximum flow rate (optional)
  • Maximum pressure loss (optional)
• Radiant floor circuit
  • Maximum flow rate (optional)
  • Check the minimum flow rate (optional)
  • Maximum pressure loss
  • Maximum pressure loss per unit length
• Cooling calculation
  • With dehumidification system (optional)
• Material schedule
  Measures the staples and perimeter bands in radiant floor systems, so that they can be included in the material schedule generated by the program.
  • Staples (optional)
    When this option is selected, you can specify the number of staples per square metre of pipe.
  • Perimeter band (optional)
    When this option is selected, the program calculates the perimeter of all rooms with a radiant floor circuit.

Types of space

Configures the space type library. Space types are generated and associated with the rooms in the model during the BIM data import process, and are also selected when adding rooms manually via the "New" option in the "Rooms" panel.

The following parameters are defined for each type of venue:

• Reference
  Reference for the space type.
• Design parameters
  In this section, you select the design parameters to be applied to the spaces of this type. These values will be automatically assigned to the various components of each space’s installation during the results update process, unless they have been locked.
  • Cooling design parameters (optional)
    • Cooling temperature
    • Sensitive refrigeration load
    • Relative humidity
  • Heating design parameters (optional)
    • Heating temperature
    • Heating load
  • Radiant floor (optional)
    Defines the parameters to be applied to the radiant floor circuits defined for rooms of this type.
    • Circuit layout in bathrooms and toilets
      When an underfloor heating circuit is used in a bathroom or toilet, this should not be taken into account when selecting the most unfavourable circuit for the same manifold during the design process, unless all the connected circuits are serving rooms of this type.
      • Consider this type of space as a bathroom or toilet (optional)
    • Surface that can be panelled
      • Only the active surface of the circuits (optional)
    • Heating
      • Maximum surface temperature of the occupied area
      • Maximum surface temperature of the peripheral area
      • Indoor temperature in the lower adjacent space
    • Cooling
      • Minimum surface temperature in the occupied area
      • Minimum surface temperature in the peripheral area
      • Internal temperature in the lower chamber
    • Thermal resistance of the floor layers
      • Floor cover
      • Structural base (roof)
      • Structural base (plaster)
    • Lower adjacent space
      • Heated (optional)

Types of static balancing valves

Configures the library of static balancing valve types. The static balancing valve type can be selected later when adding manifolds using the "Manifold" option.

The following parameters are defined for each type of static balancing valve:

• Reference
  Reference for the type of static balancing valve.
• Description
  Description of the type of static balancing valve.
• Flow coefficient (Kv)
  Each row in this table specifies a flow coefficient (Kv) for each model listed.

At the bottom, the program allows you to view information on the pressure drop associated with each flow rate value in a graph showing the relationship between the two variables.

Types of pipe

Configures the pipe type library. The pipe type is selected later when entering underfloor heating circuits using the options in the "Circuit" group.

The following parameters are defined for each type of pipe:

• Reference
  Pipe type reference.
• description
  • Outer diameter
  • Thickness
  • Radius of curvature
  • Thermal conductivity
  • Absolute roughness
  • Coating (optional)
    • Thickness
    • Thermal conductivity
  • Maximum length (optional)
• Lengths of rolls available
  In this section, you can define the available pipe roll lengths by adding rows to the table.

Types of systems

Configures the system type library. The system type is selected later when entering radiant floor circuits using the options in the "Circuit" group.

The following parameters are defined for each type of system:

• Reference
  System type reference.
• System
  Selects the type of radiant floor system from those described in the ISO 11855 standard, namely types A, B, C and E. Different parameters are defined for each system:
  • Tubes inside the panel (type A and type C)
    • Thermal resistance of the insulation panel
  • Tubes underneath the panel or wooden floor (type B)
    • Thermal resistance of the insulation panel
    • Diffuser
      • Thickness
      • Thermal conductivity
      • Width
  • Pipes embedded in large concrete slabs (type E)
    This type of system allows for the design of active slabs, thermoactive slabs or TABS (Thermo Active Building Systems). The program will determine the system’s heat transfer to both the spaces above and below.
    • Dimensions of the conductive layer
      • Thickness of the conductive layer above the pipe (s1)
      • Thickness of the conductive layer below the pipe (s2)
    • Thermal conductivity of the conductive layer
• Permitted moves
  This section defines the moves permitted by the system by adding rows to the table.